Equipment List

Lithography

EB Lithography [ELS-F125]

Manufacturer: Elionix

Model: ELS-F125

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2014

Specification: Accelaration Voltage:125kV
Beam Current:100pA~5nA
Field Stitching Accuracy:<20nm
Overlay Accuracy:<25nm
Max Sample Size:Φ6 inch

Comparison Chart

EB Lithography [ELS-BODEN100]

Manufacturer: Elionix

Model: ELS-BODEN100

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2022

Specification: Accelaration Voltage:100kV
Beam Current:100pA~20nA
Field Stitching Accuracy:<30nm
Overlay Accuracy:<35nm
Max Sample Size:Φ8 inch

Comparison Chart

Laser Lithography [DWL66+]

Manufacturer: Heidelberg Instruments

Model: DWL66+

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2021

Specification: Lithography Method:Direct laser lithography
Light Source:375nm semiconductor laser
Resolution:0.3um (HiRes)
Positioning Accuracy:<0.5um
Overlay Accuracy:<0.5um
Max Sample Size:8 inch square

Comparison Chart

Maskless Lithography [DL-1000]

Manufacturer: Nanosystem Solutions

Model: DL-1000

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2008

Specification: Lithography Method:DMD
Light Source:405nm semiconductor lase
Resolution:1um
Positioning Accuracy:<1um
Overlay Accuracy:<1um
Max Sample Size:4 inch square

Comparison Chart

Maskless Lithography [DL-1000/NC2P]

Manufacturer: Nanosystem Solutions

Model: DL-1000/NC2P

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2014

Specification: Lithography Method:DMD
Light Source:405nm semiconductor laser
Resolution:1um
Positioning Accuracy:<1um
Overlay Accuracy:<1um
Max Sample Size:8 inch square

Comparison Chart

Maskless Lithography [MLA150]

Manufacturer: Heidelberg Instruments

Model: MLA150

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2023

Specification: Lithography Method:DMD
Light Source:375nm semiconductor laser
Resolution:1um
Positioning Accuracy:<±1um
Overlay Accuracy:<±1um
Max Sample Size:8 inch square

Comparison Chart

Mask Aligner [MA-6]

Manufacturer: Suss MicroTec

Model: MA-6

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2007

Specification: Lithography Method:photo mask
Light Source:Hg lamp
Resolution:1um
Positioning Accuracy:<1um
Overlay Accuracy:<1um
Max Sample Size:Φ3 inch

Comparison Chart

Cleaning

H2O Plasma Cleaner [AQ-500 #1]

Manufacturer: Samco

Model: AQ-500

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2021

Specification: High Frequency Output:50-250W
Reactive Gas:H2O,O2
Max Sample Size:Φ8 inch

H2O Plasma Cleaner [AQ-500 #2]

Manufacturer: Samco

Model: AQ-500

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2023

Specification: High Frequency Output:50-250W
Reactive Gas:H2O,O2
Max Sample Size:Φ8 inch

UV Ozone Cleaner [UV-1]

Manufacturer: Samco

Model: UV-1

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Light Source:UV lamp
Ozone Generator:Silent electric discharge
Stage Temperature:Room temp~300℃
Max Sample Size:Φ8 inch

Deposition

Sputter [JSP-8000]

Manufacturer: ULVAC

Model: JSP-8000

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2007

Specification: Power Source:DC x 2, RF x 1
Power Output:500W
Targets:Φ4 inch×4 sets
Process Gas:Ar，O2，N2
Max Sample Size:Φ6 inch
Substrate Heating:Max. 300℃ (settable)

Comparison Chart

Sputter [CFS-4EP-LL #1]

Manufacturer: Shibaura Mechatronics

Model: CFS-4EP-LL

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2007

Specification

Power Source:DC x 2, RF x 1
Power Output:500W
Cathodes:Φ3 inch×4 sets
Process Gas:Ar, O2, N2
Max Sample Size:Φ6 inch

Substrate Heating:Max. 300℃ (settable)

Comparison Chart

Sputter [CFS-4EP-LL #2]

Manufacturer: Shibaura Mechatronics

Model: CFS-4EP-LL

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2011

Specification

Power Source:DC×2, RF×1
Power Output:500W
Cathodes:Φ3 inch×4 sets
Process Gas:Ar, O2, N2

Max Sample Size:Φ6 inch

Substrate Heating:Max. 300℃ (settable)

Comparison Chart

Sputter [CFS-4EP-LL #3]

Manufacturer: Shibaura Mechatronics

Model: CFS-4EP-LL

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2019

Specification

Power Source:DC x １, RF x ２
Power Output:500W

Cathodes:Φ3 inch×4 sets

Process Gas:Ar, O2, N2
Max Sample Size:Φ8 inch
Substrate Heating:N/A (water-cooling)

Comparison Chart

EB Evaporator [RDEB-1206K]

Manufacturer: R-DEC

Model: RDEB-1206K

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2008

Specification: Accelaration Voltage:10kV
Max Emission:500mA
T-S Distance:500mm
Vacuum Level:10-5 Pa
Max Sample Size:Φ6 inch
Materials:Ti, Au, Pd, Cu, Ag, Cr, SiO2, MgO, etc.

Comparison Chart

EB Evaporator [ADS-E86]

Manufacturer: R-DEC

Model: ADS-E86

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2021

Specification: Accelaration Voltage:6kV
Max Emission:500mA
T-S Distance:500mm
Vacuum Level:10-5 Pa
Max Sample Size:Φ8 inch
Materials:Ti, Au-Ge, Al, Ni, Au, Pt

Comparison Chart

EB Evaporator [MB-501010]

Manufacturer: ULVAC

Model: MB-501010

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2006

Specification: Accelaration Voltage:10kV
Max Emission:500mA
T-S Distance:700mm
Vacuum Level:10-5 Pa
Max Sample Size:Φ6 inch
Materials:Ag, Pd, Au, Pt, Al, Ti, Cr, Ni, etc.

Comparison Chart

EB Evaporator [UEP-3000BS]

Manufacturer: Eiko Engineering

Model: UEP-3000BS

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2019

Specification: Accelaration Voltage:10kV
Max Emission:500mA
T-S Distance:500-700mm (adjustable)
Vacuum Level:10-5 Pa
Max Sample Size:Φ3 inch
Materials:Al,Ti,Pt,Cr,Ag,Au,Fe,Ni,Pd,Cu

Comparison Chart

ALD [SUNALE R-150]

Manufacturer: Picosun

Model: SUNALE R-150

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2011

Specification: Film-Deposition Method:Thermal or plasma
Sources:TMA(Al2O3), TDMAT(TiO2), TDMAS(SiO2), TDMAHf(HfO2), ZrCp(ZrO2)
Max Sample Size:Φ6 inch
Substrate Heating:Room temp~300℃ (settable)

Comparison Chart

ALD [AD-230LP]

Manufacturer: Samco

Model: AD-230LP

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2021

Specification: Film-Deposition Method:Thermal or plasma
Sources:TMA(Al2O3, AlN), TDMAT(TiO2, TiN), BDEAS,(SiO2, SiN)
Max Sample Size:Φ8 inch
Substrate Heating:Room temp~500℃ (settable)

Comparison Chart

SiO2 PECVD [PD-220NL]

Manufacturer: Samco

Model: PD-220NL

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2022

Specification: Film-Deposition Method: 2-frequency plasma CVD
Sources:TEOS (SiO2)
Max Sample Size:8インチΦ
Substrate Heating:350℃ (default)

Comparison Chart

SiN PECVD [PD-220NL]

Manufacturer: Samco

Model: PD-220NL

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Film-Deposition Method:Plasma CVD
Sources:SN-2 (SiN)
Max Sample Size:Φ8 inch
Substrate Heating:350℃ (default)

Comparison Chart

Auto LiFt-OFF [KLO-150CBU]

Manufacturer: Kanamex

Model: KLO-150CBU

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2016

Specification: Photoresist Swelling:80℃ NMP solution
Photoresist Removal:High-pressure jet NMP solution
Rinsing:IPA, pure water; Drying:Spin-dry, N2 blow; Max Sample Size:Φ6 inch

Comparison Chart

Etching

CCP-RIE [RIE-200NL]

Manufacturer: Samco

Model: RIE-200NL

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Plasma Excitation Method:Parallel plate
Power Output:300W
Process Gas:CHF3, CF4, SF6, Ar, O2, N2
Sample Stage Temp:Room temp
Max Sample Size:Φ8 inch

Comparison Chart

ICP-RIE [RIE-101iPH]

Manufacturer: Samco

Model: RIE-101iPH

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Plasma Excitation Method:Inductive coupling
ICP Output:Max 1kW
Bias Output:Max 300W
Process Gas:Cl2, BCl3, Ar, O2, N2
Sample Stage Temp:-20℃~room temp
Max Sample Size:Φ4 inch

Comparison Chart

ICP-RIE [RV-APS-SE]

Manufacturer: Sumitomo Precision

Model: RV-APS-SE

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2012

Specification: Plasma Excitation Method:Inductive coupling
ICP Output:Max 3kW
Bias Output:Max 1kW
Process Gas:CHF3, CF4, C4F8, SF6, Ar, O2, He
Sample Stage Temp:-10~+40℃
Max Sample Size:Φ6 inch
Other: End point detector equipped

Comparison Chart

ICP-RIE [CE300I]

Manufacturer: ULVAC

Model: CE300I

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2004

Specification

Plasma Excitation Method:Inductive coupling

ICP Output:Max 1kW
Bias Output:Max 300W
Process Gas:Ar, O2, SF6, Cl2, BCl3, CF4, CHF3
Sample Stage Temp:Room temp
Max Sample Size:Φ6 inch

Comparison Chart

Si Deep RIE [ASE-SRE]

Manufacturer: Sumitomo Precision

Model: ASE-SRE

Location

Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2008

Specification

Plasma Excitation Method:Inductive coupling

ICP Output:Max 1kW
Bias Output:Max 100W
Process Gas:SF6，C4F8，Ar，O2
Sample Stage Temp:Room temp
Max Sample Size:Φ6 inch
Other: Bosch process available

Comparison Chart

ALE [PlasmaPro 100 ALE]

Manufacturer: Oxford Instruments

Model: PlasmaPro 100 ALE

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2020

Specification: Plasma Excitation Method:Inductive
ICP Output:Max 3kW
Bias Output:Max 300W
Process Gas:Cl2，BCl3，SF6，Ar，N2，O2
Sample Stage Temp:-30~+80℃
Max Sample Size:Φ6 inch
Other: End point detector equipped

Comparison Chart

Annealing

RTA [RTP-6 #1]

Manufacturer: ADVANCE RIKO

Model: RTP-6

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2005

Specification: Heating Method:Upper side heating by inflared lamp
Process Temp:Room temp~1000℃
Heating Rate:<10℃/sec
Process Gas:N2, Ar+H2(3%), Ar, O2
Max Sample Size:Φ6 inch

Comparison Chart

RTA [RTP-6 #2]

Manufacturer: ADVANCE RIKO

Model: RTP-6

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2021

Specification: Heating Method:Upper side heating by inflared lamp
Process Temp:<1100℃
Heating Rate:<10℃/sec
Process Gas:Ar, N2, Ar+H2(3%)
Max Sample Size:Φ6 inch

Comparison Chart

RTA [RTP-6 #3]

Manufacturer: ADVANCE RIKO

Model: RTP-6

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2022

Specification: Heating Method:Upper side heating by inflared lamp
Process Temp:<1100℃
eating Rate:<10℃/sec
Process Gas:N2, Ar+H2(3%), O2
Max Sample Size:Φ6 inch

Comparison Chart

Observation

FE-SEM [S-4800]

Manufacturer: Hitachi Hightec

Model: S-4800

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Acceleration Voltage:0.5～30kV
Retarding:0.1～2kV
Magnification:20～800K
Resolution:1.0 nm (15 kV), 1.4 nm (1 kV)
Detector:SE
Max Sample Size:Φ6 inch

Comparison Chart

FE-SEM+EDX [S-4800]

Manufacturer: Hitachi Hightec

Model: S-4800

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2003

Specification: Acceleration Voltage:0.5～30kV
Retarding:0.1～2kV
Magnification:20～800K
Resolution:1.0 nm (15 kV) , 1.4 nm (1 kV)
Detector:SE, BSE
Max Sample Size:Φ6 inch
EDX:HORIBA X-MAX80

Comparison Chart

FE-SEM+EDX [SU8000]

Manufacturer: Hitachi Hightec

Model: SU8000

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2010

Specification: Acceleration Voltage:0.5～30kV
Retarding:0.1～2kV
Magnification:20～800K
Resolution:1.0 nm (15 kV) , 1.3 nm (1 kV)
Detector:SE, BSE
Max Sample Size:Φ4 inch
EDX:Bruker FQ5060

Comparison Chart

FE-SEM+EDX [SU8230]

Manufacturer: Hitachi Hightec

Model: SU8230

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2014

Specification: Acceleration Voltage:0.5～30kV
Retarding:0.01～2kV
Magnification:20～1,000K
Resolution:0.8 nm (15 kV) , 1.1 nm (1 kV)
Detector:SE, BSE
Max Sample Size:Φ6 inch
EDX:HORIBA X-MAX80

Comparison Chart

Tabletop SEM+EDX [TM3000]

Manufacturer: Hitachi Hightec

Model: TM3000

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2013

Specification: Acceleration Voltage:5／15 kV
Retarding: -
Magnification:15～10K
Resolution:
Detector:BSE
Max Sample Size:70mm
EDX:Bruker Xflash MIN

Comparison Chart

SPM [Jupiter XR]

Manufacturer: Oxford Instruments

Model: Jupiter XR

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2021

Specification: Measurement Mode:Shape/mechanical/electric/magnetic measurement, etc.
Scanning Range:90um x 90um
Stage Motion Range:200mm square
Max Sample Size:Φ8 inch

Comparison Chart

SPM [L-trace]

Manufacturer: Hitachi Hightec

Model: L-trace

Location: Namiki MANA Bldg.

Overnight Operation: 〇

Installation Year: 2006

Specification: Measurement Mode:contact/tapping AFM, friction force microscope measurement, etc.
Scanning Range:90um x 90um
Stage Motion Range:
Max Sample Size:Φ6 inch

Comparison Chart

SPM [Nanoscope5]

Manufacturer: Bruker

Model: Nanoscope5

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: -

Specification: Measurement Mode:Contact AFM, tapping AFM, MFM, electrochemistry STM, liquid phase AFM
Scanning Range:
Stage Motion Range:
Max Sample Size:<Φ12mm

Comparison Chart

Laser Microscope [LEXT OLS4000]

Manufacturer: OLYMPUS

Model: LEXT OLS4000

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2012

Specification: Light Source:405nm semiconductor laser
Resolution:XY:0.12um/Z:0.01um
Observation Mode:Laser observation, bright field, differencial interference observation
Max Sample Size:100mm square

Comparison Chart

Laser Microscope [VK-9700]

Manufacturer: KEYENCE

Model: VK-9700

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2012

Specification: Light Source408nm semiconductor laser
Resolution:
Observation Mode:Laser observation, bright field
Max Sample Size:Φ100mm

Comparison Chart

Ion Sputter [E-1045]

Manufacturer: Hitachi Hightec

Model: E-1045

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2008

Specification: Film Deposition Material:Pt, C
Max Sample Size:Φ60mm

Comparison Chart

Surface Profilometer [Dektak XT-A]

Manufacturer: Bruker

Model: Dektak XT-A

Location: Sengen Materials Reliability Bldg.

Overnight Operation: 〇

Installation Year: 2021

Specification: Resolution:1Å（6.5um range）
Scanning Distance:55mm
Contact Pressure Range:0.03-15mg
Max Sample Size:Φ8 inch
Other:Automatic stage 3D mapping

Comparison Chart

Surface Profilometer [Dektak 6M]

Manufacturer: Bruker

Model: Dektak 6M

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2004

Specification: Vertical Resolution:0.1nm
Vertical Scanning Distance:Max 262µm
Measurement Distance:50 µm~30 mm
Max Sample Size:Φ6 inch

Comparison Chart

Ellipsometer [MARY-102FM]

Manufacturer: Five Lab

Model: MARY-102FM

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Light Source:632nm He-Ne laser
Beam Aperture:0.8mm
Incidence Angle:50°, 60°, 70°
Max Sample Size:Φ4 inch
Other:Automatic mapping

Comparison Chart

Spectroscopic Ellipsometer [M2000]

Manufacturer: J.A.Woollam

Model: M2000

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2010

Specification: Light Source:Deuterium halogen lamp
Spectroscopic Range:250~1000nm
Incidence Angle:45°~90°
Max Sample Size:Φ6 inch

Comparison Chart

Optical Film Mapper [F54-XY-200-UV]

Manufacturer: Filmetrics

Model: F54-XY-200-UV

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2020

Specification

Light Source:Deuterium halogen lamp

Wavelength:190~1100nm
Spot Aperture:<10um
Measurable Film Thickness:5nm~30um
Max Sample Size:6インチΦ

Comparison Chart

Thin-Film Stress Tester [FLX-2000-A]

Manufacturer: TOHO TECHNOLOGY

Model: FLX-2000-A

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2018

Specification: Measurement Method:Laser scan
Measurement Range:1~4000MPa
Measurement Reproducibility:1.3MPa (1σ)
Sample Size:Φ3, 6 or 8 inch
Other:3D mapping function

Comparison Chart

Room Temp. Prober [MX-200/B]

Manufacturer: Vector Semicon

Model: MX-200/B

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Probe:Coaxial probe
Manipulator:4
I-V Measurement Terminal:4 unit
C-V Measurement Terminal:1 unit
Max Sample Size:Φ4 inch
Other:Voltage applicable stage

Comparison Chart

Room Temp. Prober [HMP-400]

Manufacturer: HiSOL

Model: HMP-400

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2008

Specification

Probe:Coaxial probe

Manipulator:4

I-V Measurement Terminal:4 unit

C-V Measurement Terminal:1 unit

Max Sample Size:Φ4 inch
Other:Stage heating function

Comparison Chart

Low Temp. Prober [GRAIL-408-32-B]

Manufacturer: NTE

Model: GRAIL-408-32-B

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: -

Specification: Sample Cooling Method:No refrigerant
Probe:Coaxial probe
Manipulator:4
I-V Measurement Terminal:4 unit
Max Sample Size:Φ4 inch
Temperature: 8K~300K (changeable)

Comparison Chart

Liquid N2 Prober [SB-LN2]

Manufacturer: Thermal Block

Model: SB-LN2

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2011

Specification: Sample Cooling Method: Liquid nitrogen
Probe:SMA probe
Manipulator:4
I-V Measurement Terminal:4 unit
Max Sample Size:20mm square
Temperature:77K~500K (changeable)

Comparison Chart

Wire Bonder [7476D #1]

Manufacturer: West Bond

Model: 7476D

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2006

Specification: Bonding Method:Ultra sonic/ thermocompression wedge bond
Bonding Wedge:45°, 90°
Wire Material:Gold, aluminium
Work Holder Temperature:<300℃
Max Sample Size:50mm square

Comparison Chart

Wire Bonder [7476D #2]

Manufacturer: West Bond

Model: 7476D

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2008

Specification

Bonding Method:Ultra sonic/ thermocompression wedge bond
Bonding Wedge:45°, 90°
Wire Material:Gold, aluminium
Work Holder Temperature:<300℃
Max Sample Size:50mm square

Comparison Chart

Dicing

Dicing Saw [DAD322]

Manufacturer: DISCO

Model: DAD322

Location: Sengen Materials Reliability Bldg.

Overnight Operation: -

Installation Year: 2018

Specification: Dicing Blade:Diamond blade
Dicing Range:XY:<162mm
Max Sample Size:Φ6 inch

Comparison Chart

Dicing Saw [DAD3220]

Manufacturer: DISCO

Model: DAD3220

Location: Namiki MANA Bldg.

Overnight Operation: -

Installation Year: 2007

Specification: Dicing Blade:Diamond blade
Dicing Range:XY:<162mm
Max Sample Size:Φ6 inch

Comparison Chart

Equipment List

Lithography

EB Lithography [ELS-F125]

EB Lithography [ELS-BODEN100]

Laser Lithography [DWL66+]

Maskless Lithography [DL-1000]

Maskless Lithography [DL-1000/NC2P]

Maskless Lithography [MLA150]

Mask Aligner [MA-6]

Cleaning

H2O Plasma Cleaner [AQ-500 #1]

H2O Plasma Cleaner [AQ-500 #2]

UV Ozone Cleaner [UV-1]

Deposition

Sputter [JSP-8000]

Sputter [CFS-4EP-LL #1]

Sputter [CFS-4EP-LL #2]

Sputter [CFS-4EP-LL #3]

EB Evaporator [RDEB-1206K]

EB Evaporator [ADS-E86]

EB Evaporator [MB-501010]

EB Evaporator [UEP-3000BS]

ALD [SUNALE R-150]

ALD [AD-230LP]

SiO2 PECVD [PD-220NL]

SiN PECVD [PD-220NL]

Auto LiFt-OFF [KLO-150CBU]

Etching

CCP-RIE [RIE-200NL]

ICP-RIE [RIE-101iPH]

ICP-RIE [RV-APS-SE]

ICP-RIE [CE300I]

Si Deep RIE [ASE-SRE]

ALE [PlasmaPro 100 ALE]

Annealing

RTA [RTP-6 #1]

RTA [RTP-6 #2]

RTA [RTP-6 #3]

Observation

FE-SEM [S-4800]

FE-SEM+EDX [S-4800]

FE-SEM+EDX [SU8000]

FE-SEM+EDX [SU8230]

Tabletop SEM+EDX [TM3000]

SPM [Jupiter XR]

SPM [L-trace]

SPM [Nanoscope5]

Laser Microscope [LEXT OLS4000]

Laser Microscope [VK-9700]

Ion Sputter [E-1045]

Surface Profilometer [Dektak XT-A]

Surface Profilometer [Dektak 6M]

Ellipsometer [MARY-102FM]

Spectroscopic Ellipsometer [M2000]

Optical Film Mapper [F54-XY-200-UV]

Thin-Film Stress Tester [FLX-2000-A]

Room Temp. Prober [MX-200/B]

Room Temp. Prober [HMP-400]

Low Temp. Prober [GRAIL-408-32-B]

Liquid N2 Prober [SB-LN2]

Wire Bonder [7476D #1]

Wire Bonder [7476D #2]

Dicing

Dicing Saw [DAD322]

Dicing Saw [DAD3220]

Contact

Please contact NIMS Nanofabrication Unit for inquiries regarding this page.